buck
Member
- Location
- California
I am trying to some help in the requirements for bonding GEC installed in metallic conduit. Two questions: 1) Does the bonding have to occur where the GEC enters a metallic panelboard or xmfr or is the ground buss bonded to the panelboard acceptable? 2) Where the bonding occurs can a jumper of smaller size be used? Please provide a reference I can refer to as I don't see the code being clear on this.
Thanks in advance
Thanks in advance